AP210 Scope

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configuration control data pertaining to the design phase of a product's development:

characterization data:

  • the association of characteristics to classes, functional objects, physical objects, and analytical models;
  • the identification of planned parameters for functional objects, assemblies, interconnect, components, and analytical models;
  • the identification of actual parameters for functional objects, assemblies, interconnect, components, and analytical models;
  • the description of catalog data including explicit capability for binding externally defined data element type identifiers to product data types;
  • the configuration management of characterization data;
  • representation of standard si units, derived si units and units defined in other systems of units;
  • representation of class hierarchies for product data;

interface data:

  • the behavioural description of devices or physical objects, including the functional interface definition;
  • the description of the physical interface of devices or physical objects, including material characteristics and composition of the interface;
  • the behavioural description of features realized as part of the interconnect, including the functional interface definition;
  • the description of the physical interface of features realized as part of the interconnect, including material characteristics and composition;
  • the mapping between the functional and physical interface definitions;

simulation model data:

  • the configuration management of analytical model templates that are being developed concurrently;
  • the explicit interface to externally defined analytical models that define the behaviour of a functional object, a device, a physical object, an electronic assembly, or an interconnect;
  • the classification and description of analytical model template ports;
  • the identification of analytical model template libraries;

material data:

  • materials and their composition of chemical substance;
  • composite material product structure, shape and material properties;
  • classification of materials according to domain specific conductivity performance measures;
  • characterization of surface conditions including surface finish;

generic part or device data:

  • the functional description of devices or physical objects, including mapping between functional and physical terminals;
  • the physical description of devices or physical objects, including material characteristics and composition;
  • the configuration management of constituent parts or devices that are being concurrently developed;
  • the identification of libraries used for synthesis and design re-use;
  • catalogue data characterized by property value pairs or by data tables;
  • substitute and alternate product data;
  • approved supplier data;

mechanical part data:

  • the physical description of devices or physical objects, including material characteristics and composition;
  • the configuration management of constituent parts or devices that are being concurrently developed;
  • the identification of libraries used for synthesis and design re-use;
  • products that are mechanical parts;
  • catalogue data characterized by property value pairs or by data tables;

generic electrical part or device data:

  • the functional description of devices or physical objects, including mapping between functional and physical terminals;
  • the physical description of devices or physical objects, including material characteristics and composition;
  • the configuration management of constituent parts or devices that are being concurrently developed;
  • the configuration management of programmable devices and assemblies;
  • the identification of libraries used for synthesis and design re-use;
  • products that are electrical parts;
  • catalogue data characterized by property value pairs or by data tables;

electrical part or device data specific to designs that include layered interconnect:

  • the functional description of devices or physical objects, including mapping between functional and physical terminals;
  • the physical description of devices or physical objects, including material characteristics and composition;
  • the configuration management of constituent parts or devices that are being concurrently developed;
  • the configuration management of programmable devices and assemblies;
  • the identification of libraries used for synthesis and design re-use;
  • products that are electrical parts;
  • catalogue data characterized by property value pairs or by data tables;
  • the description of conductive pattern templates associated with the part or device;
  • the externally accessible connection areas in the physical description of the device;
  • the externally accessible surfaces in the physical description of the device;
  • the classification of terminals in the physical description of the device;
  • representation of interface and seating planes in the physical description of the device;
  • the classification of device terminals;
  • the physical description of terminal templates including connection areas;
  • representation of the geometric relationship between two-dimensional and three-dimensional models of the device;
  • representation of the shape of a device under different application contexts and material conditions;
  • representation of an instance of a device in an assembly;

bare semiconductor device specific data:

  • the device connection areas;
  • the device surfaces;
  • the classification of device terminals;
  • representation of an instance of a device in an assembly;

cable specific data:

  • the description of basic geometric properties of the cable;
  • the description of the interface definition of the cable;
  • the description of the functional definition of the cable;
  • representation of an instance of a cable in an assembly including connector placement;

electrical connector specific data:

  • the description of the equivalent functional network for the connector;
  • the description of physical mating characteristics;
  • the classification of connector terminals;
  • representation of an instance of a connector included in a physical layer protocol definition;
  • representation of an instance of a connector included in an interface definition;
  • representation of an instance of a connector included in an assembly as a socket for another component;
  • representation of an instance of a connector included in an assembly as an interface of that assembly;
  • representation of an instance of a connector included in a cable interface definition;

requirement data:

  • the description of the functional and non-functional requirements for the product;
  • the description of the functional and non-functional requirements for devices used in the assembly;
  • the description of the functional and non-functional requirements for devices and features used in the physical interconnection;
  • representation of electrical and thermal domain specific requirements;
  • representation of geometric model based requirements;
  • the configuration management of documents that contain requirements;
  • the allocation of requirements to functional objects, physical objects, and the physical implementation;
  • the allocation of requirements from functional objects to their physical implementation;
  • the description of the constraints on the design of the interconnect that assure product performance, incorporate quality, and enhance manufacturing process capabilities;
  • the description of production rules that represent requirements and constraints;

functional network data:

  • the hierarchical description of the functionality of the parts or devices that are used in an electronic assembly or interconnect;
  • the hierarchical description of the functional objects that are combinations of one or more functional objects;
  • the configuration management of the functional objects and networks that are being developed concurrently;
  • the description of the connection among the functional objects;
  • the binding of functional objects to simulation model templates;
  • the identification of functional object libraries;
  • representation of a functional test bench;
  • the description of electrical and thermal networks;
  • representation of binding a thermal network node to physical domain product data;

physical network data:

  • the description of the components that are in the role of function implementation for the functional network elements;
  • the description of the connection among the components that are in the role of function implementation;
  • the description of path based requirements for connections between physical terminals based on functional performance measures;
  • the description of path based requirements for connections between classes of physical terminals based on functional performance measures;
  • the configuration management of the physical network;
  • the identification of the domain of the physical network;

assembly data:

  • the physical layout of the assembly, including a description of the placement of the physical objects in the assembly;#CO_Basic_assembly
  • the description of the constraints on the design of the assembly that assure product performance, incorporate quality, and enhance manufacturing process capabilities;
  • the allocation of domain specific elements of the assembly design description to the interface description of a part or device;
  • the description of assemblies to implement various functional domains including, but not limited to, analogue, digital, video, radio frequency, and microwave;
  • the allocation of each specific connection among the devices used in the assembly to the component or group of components that realizes that connection;
  • products that are electrical assemblies or that are mechanical assemblies;
  • the description of assemblies that include more than one instance of a component in the role of interconnect;
  • representation of an instance of a part in an assembly through its usage in a sub-assembly;
  • the description of assembly panels used for manufacturing assemblies in lot quantities;
  • representation of the joint between a feature of a component in the role of interconnect and a feature of a component that is in the role of function implementation;

discrete wiring based interconnect data:

  • the description of the wires that help realize the interconnect;
  • representation of a wire in an assembly, including the wire shape and termination shape;
  • the description of other components in the assembly that help realize the interconnect;

cable based interconnect data:

  • the description of the cables that help realize the interconnect;
  • representation of the shape of the cable in an assembly, including the cable centreline curve and connector locations;

layered substrate based interconnect data:

  • the description of the material stackup, including stackups for sequential laminates and complex configurations of multiple sub-stacks;
  • the description of conductive and non-conductive materials and patterns;
  • the description of composite structures for non-conductive materials;
  • representation of hierarchical footprint patterns, including breakout patterns;
  • geometric patterns that include product data to explicitly represent detailed design intent;
  • geometric patterns that do not include detailed design intent knowledge;
  • representation of manufacturing requirements using geometric properties or electrical impedance properties;
  • geometric patterns that are manufacturable descriptions of the design, including needed manufacturing geometric elements;
  • the allocation of domain specific elements of the interconnect design description to the interface description of a part or device;
  • the description of interconnect design where transmission line effects are ignored;
  • the description of interconnect design where terminals are point on surface, point on edge, or an area in cross section of the interconnect;
  • the description of interconnect design where transmission line effects are modeled using transmission line templates;
  • the description of interconnect design where each element in the design is separately modeled using microwave design template library;
  • the functional and physical description of features realized as part of the interconnect, including material characteristics and composition;
  • representation of an instance of a part in an interconnect through its usage as an embedded component;
  • representation of assembly manufacturing specific features;
  • representation of test manufacturing specific features;
  • representation of fabrication manufacturing specific features;
  • the description of fabrication panels used for manufacturing substrates in lot quantities;

multi-domain model data:

  • the description of electrical, thermal, mechanical sub-models;
  • two-dimensional geometric representations of sub-models;
  • three-dimensional geometric representations of sub-models;
  • the description of the explicit relationships required to maintain consistency between the sub-models;
  • two dimensional shape representations of a part or device, assembly, or interconnect:
  • geometrically bounded surface models;
  • non surface bounded solid models using constructive solid geometry;

three dimensional shape representations of a part or device, assembly, or interconnect:

  • geometrically and topologically bounded wireframe models;
  • geometrically bounded surface models;
  • topologically bounded solid models with facetted, elementary and advanced faces;
  • non surface bounded solid models including constructive solid geometry, curve swept and other swept solids, thickened face solid;
  • solids with construction history;
  • topologically bounded manifold surface and subsurface and non manifold surface models;
  • topologically bounded compound models;
  • geometric validation properties to allow the translation of geometric shape representations (advanced boundary representation and faceted boundary representation solids) to be checked for quality;
  • geometric and dimensional tolerances applied to geometric shape representations;
  • three dimensional presentation of product data:
  • arranging geometric elements in layers and groups and assigning colours;
  • presentation styles for points, curves, surfaces and sections, including hatching and tiling;
  • saved views of particular camera positions and sections;
  • textual annotation and notes applied to geometric elements;
  • presentation of geometric and dimensional tolerances;
  • technical drawings as two dimensional presentation of product data.
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