AP210 Use Cases

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  • Interconnect validation
  • Requirements traceability
  • PCA/PCB Durability analysis
  • Visualization/ virtual product walkthroughs for design review
  • DFM Rule Checker[1]
  • DFT Rule Checker[2]
  • Gerber to AP 210[3]
  • PCB Stackup Design[4]
  • ECAD/MCAD data exchange[5]
  • Component Library
  • Footprint Library
  • PCB/PWB GD&T data to fabrication
  • PCA/PCB optimization through supply chain interaction
  • Other Use Cases



backup for use cases, potential and realized.

  • AP 210 Uses in Design Support:
    • Electromechanical Assembly
    • Multiple Sub Assemblies in an Assembly
    • Design Macros for Assembly and Interconnect
    • Component Grouping model
    • Design Classes
    • Interconnect Substrate Design
    • Multiple Interconnect substrates in an Assembly
    • Multiple Cables in an Assembly
    • Formal partitioning of a netlist into the elements in the Assembly that implement the netlist
    • Delay model
    • Formal Interface Control Model for Assembly
      • Formal Protocol Definition
      • Externally Visible Connector Definitions
      • Mounting holes
      • Mating features
      • Shrink Wrapped Mechanical Model
      • Shrink Wrapped Functional Model
    • Formal Interface Control Model for Interconnect
      • Mounting holes
      • Mating features
      • Shrink Wrapped Mechanical Model
      • Shrink Wrapped Functional Model
  • AP 210 Uses in Manufacturing Support:
    • PCB Fabrication
      • GD&T
      • Tooling Holes
      • Detailed Laminate Stackup model including IPC material references
      • Detailed Material Property support
    • PCA Assembly
      • Automated Assembly Line support
        • Tooling holes
        • Fiducials
      • Manual Assembly Support
    • PCA Test
      • Component physical and functional Properties
      • Physical Netlist
      • Testpoints
      • Component location and reference designation
  • AP 210 Uses in Analysis Support:
    • Thermal
    • Structural
    • Electrical
  • Support Simulation
    • Netlist Extraction
    • Property Extraction
  • Support Design Changes:
    • Track Requirements
    • Track Changes
    • Semi-automated library support
  • Support Procurement:
    • Electronic TDP (Technical Data Package)
    • RFQ Generation
    • BID Generation
  • AP 210 can support drawing exchange since AP 210 is a superset of AP 203
  • AP 210 Package Model
    • JEDEC Drawings
    • Supports GD&T
  • AP 210 Packaged Part Model
    • MIL Spec Part Drawings
    • Vendor Spec Sheets
    • Supports explicit mapping to schematic symbol terminals
  • AP 210 3D Assembly Model
    • Assembly Drawings
    • Combined Electrical and Mechanical Assemblies in one assembly model
    • Captures all Assembly notes in Requirements property based structure
  • AP 210 Interconnect substrate Model
    • Fabrication Drawings
    • Fabrication Inspection Requirements (via GD&T)
    • Drill Drawings
    • Captures all Fabrication Notes in Requirements property based structure
  • AP 210 Requirements Model
    • AP 210 is harmonized with AP 233 in common areas
  • AP 210 Requirement Allocation Model
    • Allocation and traceability of requirements to assembly, component, feature, GD&T, interconnect substrate, net, trace, copper..
    • Storage of requirement allocation is unique to STEP APs.
    • Only AP 210 has explicit requirement allocation traceability to electrical domain objects

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